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Micro-pattern Metallization using Jet-circulating Electrodeposition : 제트 순환 전해증착을 이용한 미세 패턴 금속화
DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 주종남 | - |
dc.contributor.author | 김한 | - |
dc.date.accessioned | 2017-07-13T06:26:34Z | - |
dc.date.available | 2017-07-13T06:26:34Z | - |
dc.date.issued | 2016-08 | - |
dc.identifier.other | 000000136803 | - |
dc.identifier.uri | https://hdl.handle.net/10371/118554 | - |
dc.description | 학위논문 (박사)-- 서울대학교 대학원 : 기계항공공학부, 2016. 8. 주종남. | - |
dc.description.abstract | In this dissertation, a novel micro-pattern metallization technique which works via jet-circulating electrodeposition is proposed. The metallization process consists of three steps: electron beam evaporation, jet-circulating electrodeposition, and chemical etching. A copper seed layer for electrodeposition was formed on various materials by electron beam evaporation. Jet-circulating electrodeposition was implemented to fabricate micro-metal patterns on various surfaces, such as glass, plastic and ceramic surfaces. By localizing the circulation of a jetted electrolyte through two concentric nozzles, rapid selective electrodeposition could be performed. A copper pattern with a width of 490 μm and a height of 18.3 μm was fabricated with a 290 μm electrode nozzle.
The conventional electrodeposition technique was applied to jet-circulating electrodeposition to increase deposition quality. Jet electrodeposition technique is applied to increases deposition rate. Pulse-reverse electrodeposition technique also increases deposition rate and decreases surface roughness. Furthermore diverse pulse parameter gives high flexibility to deposition process. The geometry of the copper pattern was investigated by means of scanning electron microscopy (SEM) and with a surface profiler. Finally, micro-pattern metallization using jet-circulating electrodeposition was performed on diverse substrate materials. | - |
dc.description.tableofcontents | Chapter 1. Introduction 1
1.1 Research background 1 1.2 Research purpose 6 1.3 Dissertation overview 8 Chapter 2. Electrodeposition 10 2.1 Principle of electrodeposition 10 2.2 Electrochemistry of electrodeposition 15 2.3 The metal-electrolyte interface 23 2.4 Pulse electrodeposition 28 Chapter 3. Jet-circulating electrodeposition 34 3.1 Principle of jet-circulating electrodeposition 34 3.2 Experimental system 36 3.3 Contact area in jet-circulation 43 3.4 Contact area control 51 3.5 Localized electrodeposition 57 Chapter 4. Characteristics in jet-circulating electrodeposition 67 4.1 Conventional electrodeposition techniques 67 4.2 Influence of jetting condition 74 4.3 Effect of deposition mode 81 4.4 Effect of pulse-reverse current parameter 86 4.5 Deposition on tilted surface 96 Chapter 5. Copper pattern metallization 98 5.1 Procedure of metallization process 98 5.2 Characteristic of fabricated pattern 104 Chapter 6. Conclusion 110 Bibliography 113 국문 초록 117 | - |
dc.format | application/pdf | - |
dc.format.extent | 4789075 bytes | - |
dc.format.medium | application/pdf | - |
dc.language.iso | en | - |
dc.publisher | 서울대학교 대학원 | - |
dc.subject | Jet-circulating electrodeposition | - |
dc.subject | Metallization | - |
dc.subject | Electroplating | - |
dc.subject | Direct-writing | - |
dc.subject | Micro patterning | - |
dc.subject.ddc | 621 | - |
dc.title | Micro-pattern Metallization using Jet-circulating Electrodeposition | - |
dc.title.alternative | 제트 순환 전해증착을 이용한 미세 패턴 금속화 | - |
dc.type | Thesis | - |
dc.description.degree | Doctor | - |
dc.citation.pages | 117 | - |
dc.contributor.affiliation | 공과대학 기계항공공학부 | - |
dc.date.awarded | 2016-08 | - |
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