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Copper-migration-induced dielectric breakdown in inter-layer dielectric : 층간 유전막에서의 구리 확상에 의한 유전막 파괴에 관한 연구

DC Field Value Language
dc.contributor.advisor주영창-
dc.contributor.author황상수-
dc.date.accessioned2009-11-18T22:51:42Z-
dc.date.available2009-11-18T22:51:42Z-
dc.date.copyright2007.-
dc.date.issued2007-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042923eng
dc.identifier.urihttps://hdl.handle.net/10371/13594-
dc.description학위논문(박사) --서울대학교 대학원 :재료공학부,2007.eng
dc.format.extentxviii, 147 장eng
dc.language.isoeneng
dc.publisher서울대학교 대학원eng
dc.subject구리확산. 저유전물질. 유전막파괴eng
dc.subjectCu-migrationeng
dc.subjectTDDBeng
dc.subjectlow-k dielectricseng
dc.subjectVRDBeng
dc.subjectdielectric breakdowneng
dc.subject누설전류eng
dc.subjectTDDBeng
dc.subject전자이동기작eng
dc.subjectVRDBeng
dc.subject기공eng
dc.subjectleakage currentseng
dc.subject기공연결eng
dc.subjectelectron conduction mechanismeng
dc.subjectporosityeng
dc.subjectpore interconnectioneng
dc.titleCopper-migration-induced dielectric breakdown in inter-layer dielectriceng
dc.title.alternative층간 유전막에서의 구리 확상에 의한 유전막 파괴에 관한 연구eng
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoreng
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