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ALD(Atomic Layer Deposition) 증착법을 이용한 Bi2(Ti2-xSix)O7-y 유전박막의 증착 거동 및 물성 평가에 관한 연구
Growth mechanism and characteristics of Bi2(Ti2-xSix)O7-y deposited by atomic layer deposition

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  • mendeley

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