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전자 패키징용 Sn flip-chip solder bump 에서의 pulse electromigration 에 관한 연구 : (A) Study of Pulse Electromigration in Microelectronics Sn Flip-Chip Solder Bump
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- Authors
- Advisor
- 주영창
- Issue Date
- 2009
- Publisher
- 서울대학교 대학원
- Keywords
- 솔더 일렉트로마이그레이션 ; Solder electromigration ; 일렉트로마이그레이션 ; pulse electromigration ; 플립칩 ; flip-chip ; 신뢰성 ; reliability
- Description
- 학위논문(석사) --서울대학교 대학원 :재료공학부, 2009.2.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000036883
https://hdl.handle.net/10371/14836
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