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방냉량을 고려한 천장복사냉방패널 구성요소의 설계 : Design of radiant cooling ceiling panel components considering heat output

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Authors

박주현

Advisor
김광우
Major
건축학과
Issue Date
2011-08
Publisher
서울대학교 대학원
Keywords
천장복사냉방패널설계방냉량열류패널 구성요소배관간격
Description
학위논문 (석사)-- 서울대학교 대학원 : 건축학과, 2011.8. 김광우.
Language
kor
URI
https://hdl.handle.net/10371/156920

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