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Showing results 1 to 8 of 8

Issue Date	Title / Author(s) / Citation	File
2003-12	Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of the Electrochemical Society, 151, C97-C101	view file DOI
2004-05	Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition Han, Hee; Kim, Jae Jeong; Yoon, Do Young Journal of Vacuum Science and Technology a Vacuum Surfaces and Films 22(4), 1120-1123	DOI
2005-11	A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea Kang, Moo Sung; Kim, Soo-Kil; Kim, Jae Jeong Japanese Journal of Applied Physics 44 (2005) 8107-8109	DOI
2007	Domain Switching Dynamics in Ferroelectric Films 조지영	link
2008	Property improvement of the Ruthenium thin films deposited by metal-organic chemical vapor deposition for the electrodes of the DRAM devices 김범석	link
2011-02	(The) effect of Ge addition on the materials properties and PRAM device performances using Ge-doped SbTe 박영욱	link
2015-08	A CCN activation parameterization and its impacts on cloud and precipitation simulations Kim Minyou	view file
2021	북한강 유역 청동기시대 대형 취락의 형성 과정에 관한 연구 김세진	view file link