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신경 보철 장치를 위한 액정 폴리머(LCP) 기판상의 이방성 도전필름(ACF)을 이용한 플립칩 본딩 기술에 대한 연구
Simple flip chip bonding method on flexible LCP film using ACF for neural prosthetic devices

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Authors
김정태
Advisor
김성준
Major
전기. 컴퓨터공학부
Issue Date
2011-08
Publisher
서울대학교 대학원
Keywords
ACFLCPFlip chip bonding플립 칩 본딩가속 성능 실험ACF (Anisotropic Conductive Film)LCP (Liquid Crystal Polymer)Acceleration test
Description
학위논문 (석사)-- 서울대학교 대학원 : 전기. 컴퓨터공학부, 2011.8. 김성준.
Language
kor
URI
https://hdl.handle.net/10371/159614

http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000031675
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Master's Degree_전기·정보공학부)
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