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Showing results 1 to 17 of 17

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005	구리배선형성용 연마슬러리에 사용되는 부식방지제 및 공정 연구 이종원	link
2005-01	Effect of dispersant addition during ceria abrasive milling process on light point defect (LPD) formation after shallow trench isolation chemical mechanical polishing (STI-CMP) Kang, Hyun-Goo; Katoh, Takeo; Kim, Dae-Hyung; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.44 No.1-7, pp.L238-L241	DOI
2005-08	Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization Kang, Min Cheol; Kim, Jae Jeong; Moon, Doo-Kyung Japanese Journal of Applied Physics 44(2005) 5949–5952	DOI
2005-11	Agglomerated large particles under various slurry preparation conditions and their influence on shallow trench isolation chemical mechanical polishing Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.44 No.11, pp.7770-7776	DOI
2005-12	The effect of cerium precursor agglomeration on the synthesis of ceria particles and its influence on shallow trench isolation chemical mechanical polishing performance Kim, Dae-Hyeong; Kim, Sang-Kyun; Kang, Hyun-Goo; Park, Jea-Gun; Paik, Ungyu Japanese Journal of Applied Physics, Vol.44 No.12, pp.8422-8426	DOI
2006	Triphasic CT of the Kidney in normal doy 이성옥	link
2006-05	Dependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing Kang, Hyun-Goo; Kim, Dae-Hyeong; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.5A, pp.3896-3904	DOI
2006-06	Effect of calcination process on synthesis of ceria particles, and its influence on shallow trench isolation chemical mechanical planarization performance Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.6A, pp.4893-4897	DOI
2006-09	Reduction of large particles in ceria slurry by aging and selective sedimentation and its effect on shallow trench isolation chemical mechanical planarization Kim, Dae-Hyeong; Kang, Hyun-Goo; Kim, Sang-Kyun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.9A, pp.6790-6794	DOI
2007	고성능 MPSoC를 위한 개별 2차 캐시 공간 활용 기법 윤성준	link
2008	(The)Redox reaction in Cu oxide formation and the in-situ formation of capping layer in Cu CMP 강민철	link
2008	CMP 환경을 고려한 공유 캐시 누설 에너지 관리 기법 강희준	link
2009	CMP 환경에서 공유 자원 경합을 고려한 스케줄링 기법 송욱	link
2011-02	Effects of the functional groups of complexing agent and Cu Oxide formation on the Cu CMP slurry performance 김영준	link
2017-02	Fabrication of Nano-Wedge Structured Resistive Switching Memory and Analysis on Its Switching Characteristics 이동근	view file
2018-02	다공성 슬러리 연마재를 이용한 화학적 기계적 평탄화 공정 능력 향상 및 응용 김욱환	view file
2020	Study on the reverse selective CMP on silicon based materials and post CMP Co surface for the contact formation in next generation Flash NAND Device 배기호	view file link

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