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A strain-isolation design for stretchable electronics
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Wu, Jian | - |
dc.contributor.author | Li, Ming | - |
dc.contributor.author | Chen, Wei-Qiu | - |
dc.contributor.author | Kim, Dae-Hyeong | - |
dc.contributor.author | Kim, Yun-Soung | - |
dc.contributor.author | Huang, Yong-Gang | - |
dc.contributor.author | Hwang, Keh-Chih | - |
dc.contributor.author | Kang, Zhan | - |
dc.contributor.author | Rogers, John A. | - |
dc.date.accessioned | 2020-02-17T04:33:55Z | - |
dc.date.available | 2020-02-17T04:33:55Z | - |
dc.date.created | 2018-06-29 | - |
dc.date.issued | 2010-12 | - |
dc.identifier.citation | Acta Mechanica Sinica/Lixue Xuebao, Vol.26 No.6, pp.881-888 | - |
dc.identifier.issn | 0567-7718 | - |
dc.identifier.other | 38403 | - |
dc.identifier.uri | https://hdl.handle.net/10371/164354 | - |
dc.description.abstract | Stretchable electronics represents a direction of recent development in next-generation semiconductor devices. Such systems have the potential to offer the performance of conventional wafer-based technologies, but they can be stretched like a rubber band, twisted like a rope, bent over a pencil, and folded like a piece of paper. Isolating the active devices from strains associated with such deformations is an important aspect of design. One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple, analytical model and validates the results by the finite element method. The results show that a relatively thick, compliant adhesive is effective to reduce the strain in the electronics, as is a relatively short film. | - |
dc.language | 영어 | - |
dc.publisher | Kexue Chubaneshe/Science Press | - |
dc.title | A strain-isolation design for stretchable electronics | - |
dc.type | Article | - |
dc.identifier.doi | 10.1007/s10409-010-0384-x | - |
dc.citation.journaltitle | Acta Mechanica Sinica/Lixue Xuebao | - |
dc.identifier.wosid | 000286462200008 | - |
dc.identifier.scopusid | 2-s2.0-79951721393 | - |
dc.citation.endpage | 888 | - |
dc.citation.number | 6 | - |
dc.citation.startpage | 881 | - |
dc.citation.volume | 26 | - |
dc.identifier.sci | 000286462200008 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Kim, Dae-Hyeong | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordPlus | HIGH-PERFORMANCE ELECTRONICS | - |
dc.subject.keywordPlus | SILICON INTEGRATED-CIRCUITS | - |
dc.subject.keywordPlus | LIGHT-EMITTING-DIODES | - |
dc.subject.keywordPlus | COMPLIANT SUBSTRATE | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.subject.keywordPlus | SOFT LITHOGRAPHY | - |
dc.subject.keywordPlus | INTERFACIAL ADHESION | - |
dc.subject.keywordPlus | FLEXIBLE ELECTRONICS | - |
dc.subject.keywordPlus | BUCKLING MECHANICS | - |
dc.subject.keywordPlus | STAMP COLLAPSE | - |
dc.subject.keywordAuthor | Strain isolation | - |
dc.subject.keywordAuthor | Thin film | - |
dc.subject.keywordAuthor | Substrate | - |
dc.subject.keywordAuthor | Adhesive | - |
dc.subject.keywordAuthor | Stretchable electronics | - |
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