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ULSI용 구리배선에서의 도금공정 및 결정성에 대한 연구
(A)Study on the electroplating process and crystallographic characteristics for copper interconnect

DC Field Value Language
dc.contributor.advisor이동녕-
dc.contributor.author이효종-
dc.date.accessioned2009-11-27T06:50:24Z-
dc.date.available2009-11-27T06:50:24Z-
dc.date.copyright2003.-
dc.date.issued2003-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058980kor
dc.identifier.urihttps://hdl.handle.net/10371/16803-
dc.description학위논문(박사)--서울대학교 대학원 :재료공학부,2003.kor
dc.format.extentx, 88 장kor
dc.language.isokokor
dc.publisher서울대학교 대학원kor
dc.subject구리kor
dc.subjectCopperkor
dc.subject도금kor
dc.subjectElectroplatingkor
dc.subject직접회로kor
dc.subjectULSIkor
dc.subject상감공정kor
dc.subjectEBSDkor
dc.subject전자후방산란회절kor
dc.subjectDamascenekor
dc.titleULSI용 구리배선에서의 도금공정 및 결정성에 대한 연구kor
dc.title.alternative(A)Study on the electroplating process and crystallographic characteristics for copper interconnectkor
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctorkor
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Materials Science and Engineering (재료공학부)Theses (Ph.D. / Sc.D._재료공학부)
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