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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Materials Science and Engineering (재료공학부)
Theses (Master's Degree_재료공학부)
전자기 교반이 Al-4.5%Cu 합금에서의 균열 발생에 미치는 영향
DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 오규환 | - |
dc.contributor.author | 백진홍 | - |
dc.date.accessioned | 2010-01-15T02:31:40Z | - |
dc.date.available | 2010-01-15T02:31:40Z | - |
dc.date.copyright | 1999. | - |
dc.date.issued | 1999 | - |
dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000072145 | kor |
dc.identifier.uri | https://hdl.handle.net/10371/30309 | - |
dc.description | 학위논문(석사)--서울대학교 대학원 :금속공학과,1999. | ko |
dc.format.extent | vi, 64 장 | ko |
dc.language.iso | ko | ko |
dc.publisher | 서울대학교 대학원 | ko |
dc.title | 전자기 교반이 Al-4.5%Cu 합금에서의 균열 발생에 미치는 영향 | ko |
dc.type | Thesis | - |
dc.contributor.department | 금속공학과 | - |
dc.description.degree | Master | ko |
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