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전자기 교반이 Al-4.5%Cu 합금에서의 균열 발생에 미치는 영향
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- Authors
- Advisor
- 오규환
- Issue Date
- 1999
- Publisher
- 서울대학교 대학원
- Description
- 학위논문(석사)--서울대학교 대학원 :금속공학과,1999.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000072145
https://hdl.handle.net/10371/30309
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