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레이저 간섭계(ESPI)를 통한 플립칩 패키지의 열변형 평가

DC Field Value Language
dc.contributor.advisor권동일-
dc.contributor.author장우순-
dc.date.accessioned2010-01-15T02:33:36Z-
dc.date.available2010-01-15T02:33:36Z-
dc.date.copyright2002.-
dc.date.issued2002-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061450kor
dc.identifier.urihttp://hdl.handle.net/10371/30358-
dc.description학위논문(석사)--서울대학교 대학원 :재료공학부,2002.ko
dc.format.extentii, 58 장ko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.title레이저 간섭계(ESPI)를 통한 플립칩 패키지의 열변형 평가ko
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeMasterko
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
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