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선형 가열법으로 접합한 실리콘 기판의 접합 특성에 관한 연구 : Study on the characteristics of Si wafer direct bonding using FLA method
DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 강춘식 | - |
dc.contributor.author | 이진우 | - |
dc.date.accessioned | 2010-01-16T13:54:26Z | - |
dc.date.available | 2010-01-16T13:54:26Z | - |
dc.date.copyright | 1999. | - |
dc.date.issued | 1999 | - |
dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000074133 | kor |
dc.identifier.uri | https://hdl.handle.net/10371/34584 | - |
dc.description | 학위논문(박사)--서울대학교 대학원 :금속공학과,1999. | ko |
dc.format.extent | x, 123 장 | ko |
dc.language.iso | ko | ko |
dc.publisher | 서울대학교 대학원 | ko |
dc.subject | 실리콘 직접 접합법 | ko |
dc.subject | SDB(Silicon Direct Bonding) | ko |
dc.subject | 선형가열법(FLA) | ko |
dc.subject | FLA(Fast Linear Annealing) | ko |
dc.subject | SOI(Silicon-On-Insulator) | ko |
dc.subject | Hydrogen bond | ko |
dc.subject | 수소 결합 | ko |
dc.subject | Covalent bond | ko |
dc.subject | 공유 결합 | ko |
dc.title | 선형 가열법으로 접합한 실리콘 기판의 접합 특성에 관한 연구 | ko |
dc.title.alternative | Study on the characteristics of Si wafer direct bonding using FLA method | ko |
dc.type | Thesis | - |
dc.contributor.department | 금속공학과 | - |
dc.description.degree | Doctor | ko |
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