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플립칩 패키지의 무전해 니켈 UBM 형성 : Electroless Nickel UBM formation of flip package
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이동녕 | - |
| dc.contributor.author | 정세영 | - |
| dc.date.accessioned | 2010-01-17T02:12:21Z | - |
| dc.date.available | 2010-01-17T02:12:21Z | - |
| dc.date.copyright | 2002. | - |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000063190 | kor |
| dc.identifier.uri | https://hdl.handle.net/10371/35407 | - |
| dc.description | 학위논문(박사)--서울대학교 대학원 :재료공학부,2002. | ko |
| dc.format.extent | x, 154 장 | ko |
| dc.language.iso | ko | ko |
| dc.publisher | 서울대학교 대학원 | ko |
| dc.subject | 아연 치환 | ko |
| dc.subject | flip chip package | ko |
| dc.subject | 무전해 니켈 도금 | ko |
| dc.subject | zincating | ko |
| dc.subject | 플립칩 패키징 | ko |
| dc.subject | alkaline zincating | ko |
| dc.subject | Under Bump Metallurgy(UBM) | ko |
| dc.subject | acidic zincating | ko |
| dc.subject | 아연 박리 | ko |
| dc.subject | electrolsess nickel plating | ko |
| dc.title | 플립칩 패키지의 무전해 니켈 UBM 형성 | ko |
| dc.title.alternative | Electroless Nickel UBM formation of flip package | ko |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | ko |
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