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A Study on fluxless soldering of Pb-free flip chip package : 무연솔더 플립칩 패키지의 무플럭스 솔더링에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 강춘식 | - |
| dc.contributor.author | 홍순민 | - |
| dc.date.accessioned | 2010-01-17T02:17:22Z | - |
| dc.date.available | 2010-01-17T02:17:22Z | - |
| dc.date.copyright | 2002. | - |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000060784 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/35436 | - |
| dc.description | Thesis (doctoral)--서울대학교 대학원 :재료공학부,2002. | en |
| dc.format.extent | xv, 207 p. | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.subject | Fild Chip | en |
| dc.subject | 플립칩 | en |
| dc.subject | Fluxless Soldering | en |
| dc.subject | 무플럭스 솔더링 | en |
| dc.subject | Pb-free Solder | en |
| dc.subject | 무연남재 | en |
| dc.subject | UBM | en |
| dc.subject | 젖음성 | en |
| dc.subject | Wettability | en |
| dc.subject | 납재범프 | en |
| dc.title | A Study on fluxless soldering of Pb-free flip chip package | en |
| dc.title.alternative | 무연솔더 플립칩 패키지의 무플럭스 솔더링에 관한 연구 | - |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | en |
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