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Metallorganic chemical vapor deposition(MOCVD) of tantalum oxynitride(TaOxNy) as a high k dielectric material for next generation devices : 고유전물질로서 화학기상증착법으로 증착된 탄탈륨 질산화막에 대한 연구

DC Field Value Language
dc.contributor.advisor김기범-
dc.contributor.author조성래-
dc.date.accessioned2010-01-17T02:17:25Z-
dc.date.available2010-01-17T02:17:25Z-
dc.date.copyright2002.-
dc.date.issued2002-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000060779eng
dc.identifier.urihttps://hdl.handle.net/10371/35437-
dc.descriptionThesis (doctoral)--서울대학교 대학원 :재료공학부,2002.en
dc.format.extentxi, 114 leavesen
dc.language.isoenen
dc.publisher서울대학교 대학원en
dc.titleMetallorganic chemical vapor deposition(MOCVD) of tantalum oxynitride(TaOxNy) as a high k dielectric material for next generation devicesen
dc.title.alternative고유전물질로서 화학기상증착법으로 증착된 탄탈륨 질산화막에 대한 연구-
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoren
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