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Showing results 1 to 28 of 28

Issue Date	Title / Author(s) / Citation	File
1998	Corrosion protection and adhesion promotion for etalpolymer system using silane modified polymerie materials 김현철	link
1998	화학적으로 변형된 세라믹 담체를 이용한 수용액중의 중금속의 제거에 관한 연구 김종성	link
2001	Optimized Surface Pre-treatments for Cu Electroless Plating in ULSI Device Interconnection Kim, Jae Jeong; Cha, Seung Hwan Japanese Journal of Applied Physics 40 (2001) 7151-7155	DOI
2001	Optimized Surface Pretreatments for Copper Electroplating Kim, Jae Jeong; Kim, Soo-Kil Applied Surface Science 183 (2001) 311-318	DOI
2002	Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan Japanese Journal of Applied Physics 41 (2002) L1269-L1271	DOI
2002	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2002	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2003	Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan; Lee, Young-Soo Japanese Journal of Applied Physics 42(2003) L953-L955	DOI
2004	Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 22(1), 180-184	DOI
2004	Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C101-C103	view file DOI
2004	Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C98-C100	view file DOI
2004	Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs Ahn, Eung Jin; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7(10) C118-C120	view file DOI
2004	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005	Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479	DOI
2005	Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong Journal of The Electrochemical Society 152, C330-C333	view file DOI
2005	Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing Lee, Jong Won; Kang, Min Cheol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (12), C827-C831	view file DOI
2005	Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition Kim, Soo-Kil; Hwang, Soonsik; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 9 (2), C25-C28	view file DOI
2006	미세 소자 배선 형성용 구리 전해 도금 시 단차 평탄화 공정을 위한 BTA의 작용 연구 황순식	link
2006	순환적으로 결합되는 정온기들을 갖는 NσT 앙상블 최광석	link
2007	Mechanism of plastic deformation and stress-induced surface damages in metal films 황수정	link
2007	분자 동역학을 이용한 나노 크리스탈 재료의 기계적 물성 해석 박시동	link
2007	Fabrication of metal pattern using unconventional lithography and Cu electroplating method 원영준	link
2008	Constructions and applications of metal-organic frameworks 오태록	link
2008	차세대 인쇄회로기판 배선용 관통 비아에서 구리 전해 도금 시 첨가제의 영향 연구 권기욱	link
2008	고집적 반도체용 구리 배선에서의 패턴 선폭에 따른 전기 비저항 측정 김재훈	link
2014	Magnetic zeolite-polymer composites for Cu(II) and Cr(III) removal from aqueous solutions 윤서영	view file
2016	Removal and recovery of copper ions from aqueous solution using magnetic oxidized mesoporous carbon 이인걸	view file
2017	Catalytic Reactions of Ruthenium, Copper Nanoparticles and Rhodium Homogeneous Catalysts 김주현	view file

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