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패터닝된 基板에서의 구리 電氣 鍍金層의 두께와 形象에 關한 硏究 : The Study on the thickness and the shape of the Cu electrodeposit with the patterned substrate
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 강탁 | - |
| dc.contributor.author | 김남석 | - |
| dc.date.accessioned | 2010-02-05T06:42:02Z | - |
| dc.date.available | 2010-02-05T06:42:02Z | - |
| dc.date.copyright | 1996. | - |
| dc.date.issued | 1996 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000081542 | kog |
| dc.identifier.uri | https://hdl.handle.net/10371/50826 | - |
| dc.description | 학위논문(박사)--서울大學校 大學院 :金屬工學科,1996. | ko |
| dc.format.extent | xi, 126 장 | ko |
| dc.language.iso | ko | ko |
| dc.publisher | 서울大學校 大學院 | ko |
| dc.subject | 쓰루 마스크 도금 | ko |
| dc.subject | through-mask plating | ko |
| dc.subject | 경계 요소법 | ko |
| dc.subject | boundary element method | ko |
| dc.subject | 불균일성 인자 | ko |
| dc.subject | uniformity factor | ko |
| dc.subject | 전류 분산 효과 | ko |
| dc.subject | current diverge effect | ko |
| dc.subject | 분극 기울기 | ko |
| dc.subject | polarization slope | ko |
| dc.title | 패터닝된 基板에서의 구리 電氣 鍍金層의 두께와 形象에 關한 硏究 | ko |
| dc.title.alternative | The Study on the thickness and the shape of the Cu electrodeposit with the patterned substrate | ko |
| dc.type | Thesis | - |
| dc.contributor.department | 金屬工學科 | - |
| dc.description.degree | Doctor | ko |
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