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Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier

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dc.contributor.authorCho, Sung Ki-
dc.contributor.authorKim, Soo-Kil-
dc.contributor.authorHan, Hee-
dc.contributor.authorKim, Jae Jeong-
dc.contributor.authorOh, Seung Mo-
dc.date.accessioned2009-07-24T07:08:03Z-
dc.date.available2009-07-24T07:08:03Z-
dc.date.issued2004-
dc.identifier.citationJ. Vac. Sci. Technol. B 22, 2649 (2004)en
dc.identifier.issn1071-1023-
dc.identifier.urihttp://hdl.handle.net/10371/5814-
dc.description.abstractRu thin film grown by metal organic chemical vapor deposition (MOCVD) was applied in this study
as a substrate for superconformal Cu electrodeposition as well as a Cu diffusion barrier at a
Cu/Ru/SiO2 /Si multilayer system for microelectronics. Bis (ethyl-p-cyclopentadienyl) Ru-based
MOCVD Ru thin film had a roughness of about 12% of its thickness and well-developed textures
with high purity. It also showed good step coverage in damascene trench structure. Pd
catalyst-mediated Cu electrodeposition on Ru surface accomplished formation of continuous Cu
film. For gap filling in single damascene structure, bumps indicative of bottom-up acceleration and
superfilling were observed during two-step Cu electrodeposition on Ru substrate which involved
seeding and filling with conventional three additives system. 30 nm-thick Ru film effectively
worked as a barrier for interdiffusion and/or reaction between layers even after annealing at 800 °C
for 30 min.With the exception of slight agglomeration of Cu at elevated temperature, no silicidation
or AES-profile broadening was observed in a Cu/Ru/SiO2 /Si system.
en
dc.description.sponsorshipThis work was supported by KOSEF through the Research
Center for Energy Conversion and Storage (RCECS),
LG Chemical Ltd., and also by the Institute of Chemical
Processes (ICP).
en
dc.language.isoen-
dc.publisherAmerican Vacuum Societyen
dc.titleDamascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrieren
dc.typeArticleen
dc.contributor.AlternativeAuthor조성기-
dc.contributor.AlternativeAuthor김수길-
dc.contributor.AlternativeAuthor한희-
dc.contributor.AlternativeAuthor김재정-
dc.contributor.AlternativeAuthor오승모-
dc.identifier.doi10.1116/1.1819911-
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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