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Corrosion protection and adhesion promotion for polyimide/copper system using silane-modified polymeric materials

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dc.contributor.authorKim, H.-
dc.contributor.authorJang, J.-
dc.date.accessioned2010-03-25T01:02:43Z-
dc.date.available2010-03-25T01:02:43Z-
dc.date.issued2000-
dc.identifier.citationPolymer 2000;41:6553–6561en
dc.identifier.issn0032-3861-
dc.identifier.urihttp://hdl.handle.net/10371/61950-
dc.description.abstractThe copolymers of vinyl imidazole (VI) and vinyl trimethoxy silane (VTS) were applied as corrosion inhibitors and as adhesion promoters
for polyimide/copper system at elevated temperatures. The mole ratios of VI to VTS were 100:0, 70:30, 30:70, and 0:100. Peel test was
performed to evaluate the adhesion strength of polyimide/primer/copper system after heat treatment at 4008C in nitrogen atmosphere. The
effect of the copolymer composition on corrosion protection and adhesion promotion was investigated by Fourier transform infrared
spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM). The adhesion strength of polyimide/
primer/copper system depended on the thermal stability of the primer and the chemical interaction between polyimide and the primer.
It showed the highest value when the mole ratio of VI to VTS is 30:70. The primer reduced or suppressed copper oxide formation in the
polyimide layer. The degree of corrosion protection by the primer was affected by its thermal stability and its reactivity with copper. q2000
Elsevier Science Ltd. All rights reserved.
en
dc.description.sponsorshipThe authors gratefully acknowledge the financial support
of the Korean Ministry of Education Research Fund for
Advanced Materials in 1997
en
dc.language.isoenen
dc.publisherElsevieren
dc.subjectPolyimide/copper systemen
dc.subjectAdhesion promotionen
dc.subjectCorrosion protectionen
dc.titleCorrosion protection and adhesion promotion for polyimide/copper system using silane-modified polymeric materialsen
dc.typeArticleen
dc.contributor.AlternativeAuthor김현철-
dc.contributor.AlternativeAuthor장정식-
dc.identifier.doi10.1016/S0032-3861(00)00007-0-
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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