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(A) study on the instability of porous low-k dielectric in cu interconnect : 다공성 저유전상수 물질의 열적 안정성 연구
DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 오규환 | - |
dc.contributor.author | 강석훈 | - |
dc.date.accessioned | 2010-05-04T04:46:36Z | - |
dc.date.available | 2010-05-04T04:46:36Z | - |
dc.date.copyright | 2010 | - |
dc.date.issued | 2010 | - |
dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000032457 | eng |
dc.identifier.uri | https://hdl.handle.net/10371/63874 | - |
dc.description | Thesis(doctors) --서울대학교 대학원 :재료공학부,2010.2. | en |
dc.format.extent | xi, 122 leaves | en |
dc.language.iso | en | en |
dc.publisher | 서울대학교 대학원 | en |
dc.subject | 저유전상수 물질 | en |
dc.subject | porous low-k dielectric material | en |
dc.subject | 구리 배선 | en |
dc.subject | interconnect | en |
dc.subject | 다공성 | en |
dc.subject | porosity | en |
dc.subject | 열응력 | en |
dc.subject | thermal stress | en |
dc.subject | 탄성계수 | en |
dc.subject | Youngs modulus | en |
dc.subject | 열분해 | en |
dc.subject | thermal decomposition | en |
dc.subject | 수축 | en |
dc.subject | SiCOH | en |
dc.subject | 기공 | en |
dc.subject | MSSQ | en |
dc.subject | 구리 배선 밀도 | en |
dc.subject | FTIR | en |
dc.subject | kinetics | en |
dc.subject | contraction | en |
dc.subject | voiding | en |
dc.subject | Cu pattern density | en |
dc.subject | blanket film | en |
dc.subject | cross-links | en |
dc.title | (A) study on the instability of porous low-k dielectric in cu interconnect | en |
dc.title.alternative | 다공성 저유전상수 물질의 열적 안정성 연구 | en |
dc.type | Thesis | - |
dc.contributor.department | 재료공학부 | - |
dc.description.degree | Doctor | en |
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