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Showing results 1 to 4 of 4

Issue Date	Title / Author(s) / Citation	File
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2004-08	Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C98-C100	view file DOI
2004-08	Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C101-C103	view file DOI
2004-09	Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs Ahn, Eung Jin; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7(10) C118-C120	view file DOI