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A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Jae Jeong | - |
dc.contributor.author | Kim, Soo-Kil | - |
dc.contributor.author | Kim, Young Shik | - |
dc.date.accessioned | 2010-05-12T04:54:30Z | - |
dc.date.available | 2010-05-12T04:54:30Z | - |
dc.date.issued | 2003-09-15 | - |
dc.identifier.citation | Japanese Journal of Applied Physics 42 (2003) L1080–L1082 | en |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | https://hdl.handle.net/10371/65982 | - |
dc.description.abstract | Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced
to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse clustertype deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and (111)-predominant Cu films on seedless ITO substrate. | en |
dc.language.iso | en | en |
dc.publisher | Japan Society of Applied Physics | en |
dc.subject | Cu | en |
dc.subject | electrodeposition | en |
dc.subject | ITO | en |
dc.subject | Pd | en |
dc.subject | activation | en |
dc.title | A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation | en |
dc.type | Article | en |
dc.contributor.AlternativeAuthor | 김재정 | - |
dc.contributor.AlternativeAuthor | 김수길 | - |
dc.contributor.AlternativeAuthor | 김용식 | - |
dc.identifier.doi | 10.1143/JJAP.42.L1080 | - |
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