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Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation

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dc.contributor.authorKim, Jae Jeong-
dc.contributor.authorKim, Soo-Kil-
dc.contributor.authorKim, Yong Shik-
dc.date.accessioned2010-05-12T04:58:05Z-
dc.date.available2010-05-12T04:58:05Z-
dc.date.issued2003-12-09-
dc.identifier.citationJournal of the Electrochemical Society, 151, C97-C101en
dc.identifier.issn0013-4651-
dc.identifier.urihttps://hdl.handle.net/10371/65984-
dc.description.abstractFor seedless electroplating of low resistivity Cu film applicable to deep submicrometer damascene feature, Pd activation was
introduced to direct Cu electroplating onto a high resistivity TiN barrier to get a high quality Cu film. Displacement-deposited Pd
particles on the TiN substrate acted as nucleation sites for Cu plating. This high-density instantaneous nucleation made it possible
to deposit a continuous, bright Cu film with low resistivity of 3.1 mV cm ~after annealing!. Aided by small amounts of benzotriazole,
Pd activation also gave way to the application of seedless plating to superfilling of a deep submicrometer damascene
structure, where the formation of the seed layer had been a critical issue. Poor adhesion between plated Cu and Pd activated TiN
substrate was greatly improved by the addition of poly~ethylene glycol!. The change in film characteristics was found to be
negligible.
en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.subjectintegrated circuit metallisationen
dc.subjectpalladiumen
dc.subjecttitanium compoundsen
dc.subjectelectroplatingen
dc.subjectadhesionen
dc.subjectnucleationen
dc.subjectmetallic thin filmsen
dc.subjectelectrical resistivityen
dc.subjectdiffusion barriersen
dc.titleDirect Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activationen
dc.typeArticleen
dc.contributor.AlternativeAuthor김재정-
dc.contributor.AlternativeAuthor김수길-
dc.contributor.AlternativeAuthor김용식-
dc.identifier.doi10.1149/1.1633269-
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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