Publications
Detailed Information
Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization
Cited 8 time in
Web of Science
Cited 8 time in Scopus
- Authors
- Issue Date
- 2005-08-05
- Publisher
- Japan Society of Applied Physics
- Citation
- Japanese Journal of Applied Physics 44(2005) 5949–5952
- Keywords
- CMP ; ceria ; selectivity ; zeta potential ; hydration
- Abstract
- An increase in the removal selectivity between silicon oxide and silicon nitride was attempted by adding organic additives to a
ceria slurry for the application of shallow trench isolation (STI) chemical mechanical planarization (CMP). The protection
behavior of poly(acrylic acid) (PAA) and the acceleration behavior of RE-610 in a ceria slurry were studied. PAA served as a
protector of the silicon nitride due to the change in zeta potential. RE-610 worked as a hydration accelerator of the silicon
oxide. When the two additives were added to the ceria slurry, the removal selectivity increased to 31 : 1. Moreover, PAA
improved the stability of the ceria slurry.
- ISSN
- 0021-4922
- Language
- English
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.