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Showing results 1 to 9 of 9

Issue DateTitle / Author(s) / CitationFileAltmetrics
2004-11
Superconformal Cu Electrodeposition on Various Substrates

Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo

Electrochemical and Solid-State Letters, 8(1), C19-C21

view fileDOI
2005-03
Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent

Lee, Chang Hwa; Kim, Jae Jeong

Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479

DOI
2005-05
The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating

Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong

Journal of The Electrochemical Society, 152 (6), C388-C391

view fileDOI
2005-06
Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS)

Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong

Electrochemical and Solid-State Letters, 8 (8), C110-C113

view fileDOI
2008
Study on the initial steps in Ag electroless and electrodeposition
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2013-02
Fabrication of Pt-Based Electro-Catalyst for Polymer Electrolyte Membrane Fuel Cell
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2013-08
in-situ Transmittance Evaluation of Solutions for Cu Electroless Deposition and Its Applications
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2018-10
Solution-processed metal coating to nonwoven fabrics for wearable rechargeable batteries
DOI
2021-02
Study on the kinetics of formation and growth of Cu-EDTA system in homo- and heterogeneous phase using gravimetric method, and stability characteristics of Pt and Pd using self-terminating electrodeposition method.
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