Browse

Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs

DC Field Value Language
dc.contributor.authorAhn, Eung Jin-
dc.contributor.authorKim, Jae Jeong-
dc.date.accessioned2010-05-12T23:14:45Z-
dc.date.available2010-05-12T23:14:45Z-
dc.date.issued2004-09-07-
dc.identifier.citationElectrochemical and Solid-State Letters, 7(10) C118-C120en
dc.identifier.issn1099-0062-
dc.identifier.urihttps://hdl.handle.net/10371/66000-
dc.description.abstractFor Ag electroplating in a damascene structure, two additives were tried in the electrolyte composed of KAg(CN)2 and KCN. One
additive, thiourea, played a role as a suppressor and a brightener on a Ag seed layer. The other additive, benzotriazole, worked as
an inhibitor on a Cu seed layer whereas it acted as an accelerator on the Ag seed layer. When these two additives were added to
the electrolyte, the superconformal electroplating of Ag thin film for ultralarge scale integrateds ~ULSIs! was accomplished
successfully without defects in the damascene structure with a width of 400 nm and an aspect ratio was 4.
en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.subjectsilveren
dc.subjectadditivesen
dc.subjectmetallic thin filmsen
dc.subjectelectroplatingen
dc.subjectinhibitorsen
dc.subjectelectrolytesen
dc.subjectcopperen
dc.subjectorganic compoundsen
dc.titleAdditives for Super-conformal Electroplating of Ag Thin Film for ULSIsen
dc.typeArticleen
dc.contributor.AlternativeAuthor안응진-
dc.contributor.AlternativeAuthor김재정-
dc.identifier.doi10.1149/1.1793811-
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
Files in This Item:
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse