서울대학교 중앙도서관

S-Space 소개

My S-Space

로그인이 필요합니다.

Login

S-Space

Browse

Subject

Jump to a point in the index

Or type in a year

Sort by
In order
Results/Page
Authors/record

Showing results 1 to 10 of 10

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2003-12	Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of the Electrochemical Society, 151, C97-C101	view file DOI
2004-01	Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor Kwon, Oh Joong; Cha, Seung Hwan; Kim, Jae Jeong Journal of the Electrochemical Society, 151, C127-C132	view file DOI
2004-01	Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 22(1), 180-184	DOI
2004-05	Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition Han, Hee; Kim, Jae Jeong; Yoon, Do Young Journal of Vacuum Science and Technology a Vacuum Surfaces and Films 22(4), 1120-1123	DOI
2004-09	Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs Ahn, Eung Jin; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7(10) C118-C120	view file DOI
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005-04	Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong Journal of The Electrochemical Society 152, C330-C333	view file DOI
2005-05	The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (6), C388-C391	view file DOI
2005-06	Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (8), C110-C113	view file DOI

1