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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005-11	A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea Kang, Moo Sung; Kim, Soo-Kil; Kim, Jae Jeong Japanese Journal of Applied Physics 44 (2005) 8107-8109	DOI