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Issue Date	Title / Author(s) / Citation	File
2002-12	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2004-01	Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor Kwon, Oh Joong; Cha, Seung Hwan; Kim, Jae Jeong Journal of the Electrochemical Society, 151, C127-C132	view file DOI