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Showing results 1 to 25 of 25

Issue Date	Title / Author(s) / Citation	File
1998	Cu 배선공정에서 확산방지막으로서 TiN 박막에 대한 연구 박기철	link
2003-09	A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Young Shik Japanese Journal of Applied Physics 42 (2003) L1080–L1082	DOI
2004	CuZn superoxide dismutase 발현 세포주에서 성장호르몬의 세포보호 및 성장효과에 대한 연구 여에스더	link
2004	Advanced metallization for high performance devices using superconformal Cu electrodeposition 김수길	link
2005	구리 열 증착 공정 중 발생하는 전류의 극성 변화와 근원 신봉규	link
2005	Investigation on the surface treatment for advanced metallization technique in micro device 차승환	link
2005	Cytotoxic effect of alteration in intracellular calcium homeostasis on motor neuronal cells expressing mutant CuZn superoxide dismutase 김현정	link
2005-11	A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea Kang, Moo Sung; Kim, Soo-Kil; Kim, Jae Jeong Japanese Journal of Applied Physics 44 (2005) 8107-8109	DOI
2006	Alteration of cytoskeletal proteins in motor neuronal cells expressing mutant CuZn superoxide dismutase 홍윤호	link
2007	다마신 구리 전해 도금에서 정펄스 및 정펄스-역펄스 전류를 이용한 패턴 채움 연구 김승수	link
2007	Reliability issues for high performance Cu interconnects : 김기수	link
2007	돌연변이 CuZn superoxide dismutase(SOD1)을 발현하는 운동신경세포의 사멸에서 heat shock protein 70(HSP70)의 신경보호효과에 관한 연구 김미연	link
2008	(The)Redox reaction in Cu oxide formation and the in-situ formation of capping layer in Cu CMP 강민철	link
2008	Differences in Lipid Peroxidation and Cu,Zn-Superoxide Dismutase in the Hippocampal CA1 Region Between Adult and Aged Dogs Hwang, In Koo; Yoon, Yeo Sung; Yoo, Ki-Yeon; Li, Hua; Choi, Jung Hoon; Kim, Dae Won; Yi, Sun Shin; Sung, Je Kyeong; Lee, In Se; Won, Moo-Ho J. Vet. Med. Sci. 70: 273-277	view file DOI
2008	돌연변이 CuZn SOD1이 발현되는 운동신경세포에서 세포질 내 아연 이온의 신경독성 효과 조애신	link
2009	Superfilling and leveling in damascene Cu electrodeposition for high performance semiconductor devices 조성기	link
2009	Microstructure evolution and associated properties of inkjet-printed metal films 이설민	link
2011-02	Effects of the functional groups of complexing agent and Cu Oxide formation on the Cu CMP slurry performance 김영준	link
2013-02	The influences of pulse and pulse-reverse electrodeposition on the properties of Cu thin films and superfilling for the fabrication of Cu interconnection 김명준	view file
2013-08	in-situ Transmittance Evaluation of Solutions for Cu Electroless Deposition and Its Applications 박경주	view file
2016-02	Thermally Driven Intrinsic and Extrinsic Doping Mechanisms in Amorphous Oxide Semiconductors 연한울	view file
2016-02	Decomposition of Bis(3-Sulfopropyl) Disulfide and Poly(Ethylene Glycol-Propylene Glycol) during Cu Electrodeposition and Its Monitoring via Electrochemical Method 최승회	view file
2017-02	Superfilling of Through-Silicon-Vias by Cu Electrodeposition with Iodide-based Levelers and Improvement of Filling Efficiency by Adding Thiourea 김회철	view file
2020	Additive Development for Extreme Bottom-up Filling of Through Silicon Via: from Inorganic Halide Leveler to Synthesized Additive Containing Quaternary Ammonium Cations and Naphthalene Ring for Single Additive System 성민재	view file link
2021	A Study on the Control for Decomposition of Bis-(3-Sulfopropyl) Disulfide (SPS) and Polyethylene Glycol (PEG) Additive in Copper Electrodeposition Bath 김태영	view file link