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Showing results 346 to 365 of 29,082

Issue Date	Title / Author(s) / Citation	File
2018-06	A "Sticky" mucin-inspired DNA-polysaccharide binder for silicon and silicon-graphite blended anodes in lithium-ion batteries Kim, Sunjin; Jeong, You Kyeong; Wang, Younseon; Lee, Haeshin; Choi, Jang Wook Advanced Materials, Vol.30 No.26, p. 1707594	DOI
2019-06	A 0.1 1.62-to-10.8Gb/s Video interface Receiver with Fully Adaptive Equalization Using Un-Even Data Level Lee, Jinhyung; Lee, Kwangho; Kim, Hyojun; Kim, Byungmin; Park, Kwanseo; Jeong, Deog-Kyoon 2019 SYMPOSIUM ON VLSI CIRCUITS, pp.C198-C199
2020-11	A 0.4-1.7GHz Wide Range Fractional-N PLL Using a Transition-Detection DAC for Jitter Reduction Yun, Jaekwang; Lee, Sangyoon; Jeong, Yong-Un; Jeong, Shin-Hyun; Kim, Suhwan 2020 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC), p. 9336144	DOI
2018-11	A 0.6-to-1V 10k-to-100kHz BW 11.7b-ENOB Noise-Shaping SAR ADC for IoT sensor applications in 28-nm CMOS Hwang, Young-Ha; Song, Yoonho; Park, Jun-Eun; Jeong, Deog-Kyoon 2018 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC): PROCEEDINGS OF TECHNICAL PAPERS, pp.247-248	DOI
2020-02	A 0.8-to-2.3GHz Quadrature Error Corrector with Correctable Error Range of 101.6ps Using Minimum Total Delay Tracking and Asynchronous Calibration On-Off Scheme for DRAM Interface Shin, Soyeong; Ko, Han-Gon; Jang, Sungchun; Kim, Dongkyun; Jeong, Deog-Kyoon 2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC), pp.340-342	DOI
2020-10	A 0.83-pJ/Bit 6.4-Gb/s HBM Base Die Receiver Using a 45 degrees Strobe Phase for Energy-Efficient Skew Compensation Lee, Sangyoon; Ko, Han-Gon; Chae, Joo-Hyung; Shin, Soyeong; Yun, Jaekwang; Jeong, Deog-Kyoon; Kim, Suhwan IEEE Transactions on Circuits and Systems II: Express Briefs, Vol.67 No.10, pp.1735-1739	DOI
2023	A 13.2 KSPS DATA-RATE 5.1 GΩ INPUT IMPEDANCE READ-OUT SYSTEM FOR BRIDGE SENSORS 박준영	view file link
2019-05	A 16 bit Incremental ADC with Swapping DAC for Low Power Sensor Applications Jun, Jaehoon; Kang, Junho; Kim, Suhwan 2019 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), p. 8702784	DOI
2007-01	A 160-kilobit molecular electronic memory patterned at 10(11) bits per square centimetre Green, Jonathan E.; Choi, Jang Wook; Boukai, Akram; Bunimovich, Yuri; Johnston-Halperin, Ezekiel; DeIonno, Erica; Luo, Yi; Sheriff, Bonnie A.; Xu, Ke; Shin, Young Shik; Tseng, Hsian-Rong; Stoddart, J. Fraser; Heath, James R. Nature, Vol.445 No.7126, pp.414-417	DOI
2016-08	A 1T-DRAM cell based on a tunnel field-effect transistor with highly-scalable pillar and surrounding gate structure Kim, Hyungjin; Park, Byung-Gook Journal of the Korean Physical Society, Vol.69 No.3, pp.323-327	DOI
2022-06	A 2.5 -32 Gb/s Gen 5-PCIe Receiver with Multi-Rate CDR Engine and Hybrid DFE Choi, Moon-Chul; Lee, Sanghee; Roh, Seungha; Lee, Kwangho; Oh, Jonghyun; Kim, Sungwoo; Kim, Kwandong; Choi, Woo-Seok; Kim, Jaeha; Jeong, Deog-Kyoon IEEE Transactions on Circuits and Systems II: Express Briefs, Vol.69 No.6, pp.2677-2681	DOI
2019-05	A 20Gb/s Dual-Mode PAM4/NRZ Single-Ended Transmitter with RLM Compensation Hyun, Changho; Ko, Hyeongjun; Chae, Joo-Hyung; Park, Hyunkyu; Kim, Suhwan 2019 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), p. 8702456	DOI
2020-06	A 28-Gb/s/pin PAM-4 Single-Ended Transmitter with High-Linearity and Impedance-Matched Driver and 3-Point ZQ calibration for Memory Interfaces Jeong, Yong-Un; Park, Hyunkyu; Hyun, Changho; Kim, Suhwan 2020 IEEE SYMPOSIUM ON VLSI CIRCUITS, p. 9162864	DOI
2020-06	A 2D Titanium Carbide MXene Flexible Electrode for High-Efficiency Light-Emitting Diodes Ahn, Soyeong; Han, Tae-Hee; Maleski, Kathleen; Song, Jinouk; Kim, Young-Hoon; Park, Min-Ho; Zhou, Huanyu; Yoo, Seunghyup; Gogotsi, Yury; Lee, Tae-Woo Advanced Materials, Vol.32 No.23, p. 2000919	view file DOI
2022-09	A 32-Gb/s PAM4-Binary Bridge With Sampler Offset Cancellation for Memory Testing Yun, Daeho; Lee, Eonhui; Jung, Woosong; Kim, Kahyun; Beak, Kyung-Min; Kim, Jihee; Lee, Hyun-Bae; Ko, Byeongseon; Choi, Woo-Seok; Jeong, Deog-Kyoon IEEE Transactions on Circuits and Systems II: Express Briefs, Vol.69 No.9, pp.3749-3753	DOI
2019-06	A 370-fJ/b, 0.0056 mm(2)/DQ, 4.8-Gb/s DQ Receiver for HBM3 with a Baud-Rate Self-Tracking Loop Ko, Han-Gon; Shin, Soyeong; Kye, Chan-Ho; Lee, Sang-Yoon; Yun, Jaekwang; Jung, Hae-Kang; Lee, Duobock; Kim, Suhwan; Jeong, Deog-Kyoon 2019 SYMPOSIUM ON VLSI CIRCUITS, pp.C94-C95	DOI
2021-04	A 3D MODEL-BASED APPROACH FOR FITTING MASKS TO FACES IN THE WILD Hong, Je Hyeong; Kim, Hanjo; Kim, Minsoo; Nam, Gi Pyo; Cho, Junghyun; Ko, Hyeong-Seok; Kim, Ig-Jae Proceedings - International Conference on Image Processing, ICIP, pp.235-239	DOI
2021-10	A 3D printing route to fabrication of ZrCuSi alloy target for ZrCuSiN nanocomposite thin films Byun, Myunghwan; Kim, Chung-Soo; Kim, Dong-Hyun; Hwang, Jong-Uk; Lee, Ju-Ho; Park, Eun Soo Applied Surface Science, Vol.562, p. 150136	DOI
2019-06	A 4-to-20Gb/s 1.87pJ/b Referenceless Digital CDR With Unlimited Frequency Detection Capability in 65nm CMOS Park, Kwanseo; Lee, Kwangho; Cho, Sung-Yong; Lee, Jinhyung; Hwang, Jeongho; Choo, Min-Seong; Jeong, Deog-Kyoon 2019 SYMPOSIUM ON VLSI CIRCUITS, pp.C194-C195	DOI
2021-11	A 48 Gb/s PAM4 receiver with Baud-rate phase-detector for multi-level signal modulation in 40 nm CMOS Lee, Kwangho; Jung, Woosong; Ju, Haram; Lee, Jinhyung; Jeong, Deog-Kyoon IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC 2021)	DOI

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