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플립칩용 무전해 니켈 UBM에 관한 연구 : (A)Study on the electroless Ni UBM for the flip chip packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이동녕 | - |
| dc.contributor.author | 이종호 | - |
| dc.date.accessioned | 2009-11-18T03:16:32Z | - |
| dc.date.available | 2009-11-18T03:16:32Z | - |
| dc.date.copyright | 2003. | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000057891 | kor |
| dc.identifier.uri | https://hdl.handle.net/10371/12833 | - |
| dc.description | 학위논문(박사)--서울대학교 대학원 :재료공학부,2003. | kor |
| dc.format.extent | xi, 135 장 | kor |
| dc.language.iso | ko | - |
| dc.publisher | 서울대학교 대학원 | kor |
| dc.subject | Zincate | kor |
| dc.subject | Electroless Ni | kor |
| dc.subject | Packaging | kor |
| dc.subject | Lead-free solder | kor |
| dc.subject | UBM(under bump metallization) | kor |
| dc.subject | Soldering | kor |
| dc.title | 플립칩용 무전해 니켈 UBM에 관한 연구 | kor |
| dc.title.alternative | (A)Study on the electroless Ni UBM for the flip chip packaging | kor |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | kor |
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