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Electrochemical migration behavior of Sn-based solder alloys for electronic packaging : 전자 패키징용 Sn계 솔더 합금의 Electrochemical migration 거동에 관한 연구

DC Field Value Language
dc.contributor.advisor주영창-
dc.contributor.author이신복-
dc.date.accessioned2009-11-18T03:28:25Z-
dc.date.available2009-11-18T03:28:25Z-
dc.date.copyright2009.-
dc.date.issued2009-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000038125eng
dc.identifier.urihttps://hdl.handle.net/10371/12863-
dc.descriptionThesis(doctors) --서울대학교 대학원 :재료공학부,2009.8.eng
dc.format.extentxiv, 189 leaveseng
dc.language.isoeneng
dc.publisher서울대학교 대학원eng
dc.subject전기화학 마이그레이션eng
dc.subjectelectrochemical migrationeng
dc.subject부식eng
dc.subjectcorrosioneng
dc.subject수지상 필라멘트eng
dc.subjectdendritic filamenteng
dc.subject전도성 양극 필라멘트eng
dc.subjectconductive anodic filamenteng
dc.subject물방울 적하 시험eng
dc.subjectSneng
dc.subject양극 분극 시험eng
dc.subjectSnPbeng
dc.subject부동태eng
dc.subjectSnAgCueng
dc.subject신뢰성eng
dc.subjectwater-drop testeng
dc.subject전자패키징eng
dc.subjectanodic polarization testeng
dc.subjectpassivityeng
dc.subjectreliabilityeng
dc.subjectelectronic packageeng
dc.titleElectrochemical migration behavior of Sn-based solder alloys for electronic packagingeng
dc.title.alternative전자 패키징용 Sn계 솔더 합금의 Electrochemical migration 거동에 관한 연구eng
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoreng
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