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은 무전해 도금에서 주석 민감화와 팔라듐 활성화를 이용한 표면 전처리 방법 연구

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Authors

김서영

Advisor
김재정
Issue Date
2006
Publisher
서울대학교 대학원
Keywords
반도체semiconductor금속 배선metal interconnectionAg무전해 도금electroless plating주석Sn팔라듐Pd전처리 방법pretreatment씨앗층seed layer
Description
학위논문(석사)--서울대학교 대학원 :화학생물공학부,2006.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000047856

https://hdl.handle.net/10371/13451
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