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ULSI용 구리배선에서의 도금공정 및 전기화학적 특성 분석 : A study on the electroplating process and electrochemical characteristics for Cu interconnect
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 강탁 | - |
| dc.contributor.author | 이의형 | - |
| dc.date.accessioned | 2009-11-18T22:51:21Z | - |
| dc.date.available | 2009-11-18T22:51:21Z | - |
| dc.date.copyright | 2007. | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042934 | kor |
| dc.identifier.uri | https://hdl.handle.net/10371/13593 | - |
| dc.description | 학위논문(박사) --서울대학교 대학원 :재료공학부,2007. | kor |
| dc.format.extent | xii, 128 장 | kor |
| dc.language.iso | ko | kor |
| dc.publisher | 서울대학교 대학원 | kor |
| dc.subject | 도금 | kor |
| dc.subject | electroplating | kor |
| dc.subject | damascene | kor |
| dc.subject | damascene | kor |
| dc.subject | superfilling | kor |
| dc.subject | superfilling | kor |
| dc.subject | 유기 첨가제 | kor |
| dc.subject | additives | kor |
| dc.subject | 부식 | kor |
| dc.subject | corrosion | kor |
| dc.subject | self anneal | kor |
| dc.subject | self anneal | kor |
| dc.title | ULSI용 구리배선에서의 도금공정 및 전기화학적 특성 분석 | kor |
| dc.title.alternative | A study on the electroplating process and electrochemical characteristics for Cu interconnect | kor |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | kor |
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