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SnPb계 및 SnAg계 플립칩 솔더의 electromigration 특성 평가
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 주영창 | - |
| dc.contributor.author | 최재영 | - |
| dc.date.accessioned | 2009-11-24T23:27:07Z | - |
| dc.date.available | 2009-11-24T23:27:07Z | - |
| dc.date.copyright | 2003. | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000057606 | kor |
| dc.identifier.uri | https://hdl.handle.net/10371/14699 | - |
| dc.description | 학위논문(석사)--서울대학교 대학원 :재료공학부,2003. | kor |
| dc.format.extent | ix, 73 장 | kor |
| dc.language.iso | ko | - |
| dc.publisher | 서울대학교 대학원 | kor |
| dc.subject | Electromigration | kor |
| dc.subject | Electromigration | kor |
| dc.subject | 플립칩 솔더 범프 | kor |
| dc.subject | Flip chip solder bump | kor |
| dc.subject | 활성화 에너지 | kor |
| dc.subject | Activation energy | kor |
| dc.title | SnPb계 및 SnAg계 플립칩 솔더의 electromigration 특성 평가 | kor |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Master | kor |
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