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SnPb계 및 SnAg계 플립칩 솔더의 electromigration 특성 평가

DC Field Value Language
dc.contributor.advisor주영창-
dc.contributor.author최재영-
dc.date.accessioned2009-11-24T23:27:07Z-
dc.date.available2009-11-24T23:27:07Z-
dc.date.copyright2003.-
dc.date.issued2003-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000057606kor
dc.identifier.urihttp://hdl.handle.net/10371/14699-
dc.description학위논문(석사)--서울대학교 대학원 :재료공학부,2003.kor
dc.format.extentix, 73 장kor
dc.language.isoko-
dc.publisher서울대학교 대학원kor
dc.subjectElectromigrationkor
dc.subjectElectromigrationkor
dc.subject플립칩 솔더 범프kor
dc.subjectFlip chip solder bumpkor
dc.subject활성화 에너지kor
dc.subjectActivation energykor
dc.titleSnPb계 및 SnAg계 플립칩 솔더의 electromigration 특성 평가kor
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeMasterkor
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
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