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Sn계 솔더물질의 electromigration 에서 임계전류밀도 분석 : Threshold current density on electromigration of Sn-based solders

DC Field Value Language
dc.contributor.advisor주영창-
dc.contributor.author김빛나-
dc.date.accessioned2009-11-25T03:02:41Z-
dc.date.available2009-11-25T03:02:41Z-
dc.date.copyright2007.-
dc.date.issued2007-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000043702kor
dc.identifier.urihttps://hdl.handle.net/10371/15063-
dc.description학위논문(석사) --서울대학교 대학원 :재료공학부,2007.kor
dc.format.extent70 장kor
dc.language.isoko-
dc.publisher서울대학교 대학원kor
dc.subjectelectromigrationkor
dc.subjectelectromigrationkor
dc.subjectSnAgCukor
dc.subjectSnAgCukor
dc.subject공융조성 SnPbkor
dc.subjecteutectic SnPbkor
dc.subjectBlech productkor
dc.subjectBlech productkor
dc.subject임계전류밀도kor
dc.subjectthreshold current densitykor
dc.titleSn계 솔더물질의 electromigration 에서 임계전류밀도 분석kor
dc.title.alternativeThreshold current density on electromigration of Sn-based solderskor
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeMasterkor
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