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Thermal-aware resource binding problems in high-level synthesis
상위 수준 합성에서의 열 발산을 고려한 자원 할당 문제 연구

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Authors
임필옥
Advisor
김태환
Major
전기·컴퓨터공학부
Issue Date
2011-02
Publisher
서울대학교 대학원
Keywords
상위수준합성칩온도핫스팟자원할당interconnect delay3D IChigh-level synthesispeak temperatureresource binding
Description
학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2011.2. 김태환.
Language
eng
URI
http://hdl.handle.net/10371/159080

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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Ph.D. / Sc.D._전기·정보공학부)
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