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ULSI용 구리배선에서의 도금공정 및 결정성에 대한 연구 : (A)Study on the electroplating process and crystallographic characteristics for copper interconnect
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- Authors
- Advisor
- 이동녕
- Issue Date
- 2003
- Publisher
- 서울대학교 대학원
- Description
- 학위논문(박사)--서울대학교 대학원 :재료공학부,2003.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058980
https://hdl.handle.net/10371/16803
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