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Effect of Device Scaling on Lateral Migration Mechanism of Electrons in V-NAND

Cited 7 time in Web of Science Cited 6 time in Scopus
Authors

Woo, Changbeom; Kim, Shinkeun; Park, Jaeyeol; Shin, Hyungcheol

Issue Date
2019-06
Publisher
IEEE
Citation
2019 SILICON NANOELECTRONICS WORKSHOP (SNW), pp.27-28
Abstract
In this paper, we analyzed lateral migration (LM) mechanism of V-NAND occurring during retention operation depending on scaling of geometric parameters using TCAD simulation. Modeling for LM was performed and the behavior of time-constant (tau) parameter used for modeling was analyzed. In addition, we analyzed retention characteristics according to the states of neighbor word line (WLNei.). Comparing the extracted tau for different patterns, checker-board pattern (C/P) has the smallest tau, followed by NPN and solid pattern (S/P).
ISSN
2161-4636
URI
https://hdl.handle.net/10371/186744
DOI
https://doi.org/10.23919/SNW.2019.8782947
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