FAN OUT PACKAGE : PERFORMANCE AND SCALABILITY PERSPECTIVE

Abstract

Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (< 200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (similar to 100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.