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Monolithic integration of GaAs//InGaAs photodetectors for multicolor detection

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dc.contributor.authorGeum, Dae-Myeong-
dc.contributor.authorKim, SangHyeon-
dc.contributor.authorKim, SeongKwang-
dc.contributor.authorKang, SooSeok-
dc.contributor.authorKylun, JiHoon-
dc.contributor.authorSong, Jindong-
dc.contributor.authorChoi, Won Jun-
dc.contributor.authorYoon, Euijoon-
dc.date.accessioned2022-10-26T07:41:36Z-
dc.date.available2022-10-26T07:41:36Z-
dc.date.created2022-10-19-
dc.date.issued2019-06-
dc.identifier.citation2019 SYMPOSIUM ON VLSI TECHNOLOGY, pp.T248-T249-
dc.identifier.urihttps://hdl.handle.net/10371/187003-
dc.description.abstractMulticolor photodetectors (PDs) by using bulk p-i-n based visible GaAs and near-infrared (IR) InGaAs PD have been successfully fabricated via monolithic integration by wafer bonding and epitaxial lift-off. It showed high-performance individual operation comparable to that of bulk PDs with tight vertical alignment on a single substrate future high-resolution multicolor PDs. At the same time, it covered broad wavelength range from visible to IR.-
dc.language영어-
dc.publisherIEEE-
dc.titleMonolithic integration of GaAs//InGaAs photodetectors for multicolor detection-
dc.typeArticle-
dc.identifier.doi10.23919/VLSIT.2019.8776526-
dc.citation.journaltitle2019 SYMPOSIUM ON VLSI TECHNOLOGY-
dc.identifier.wosid000555822600045-
dc.identifier.scopusid2-s2.0-85070341428-
dc.citation.endpageT249-
dc.citation.startpageT248-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorYoon, Euijoon-
dc.type.docTypeProceedings Paper-
dc.description.journalClass1-
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