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Low-Cost Packaging of 300 GHz Integrated Circuits With an On-Chip Patch Antenna (vol 18, pg 2444, 2019)

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Authors

Bakshi, Harshpreet S.; Byreddy, Pranith R.; O, Kenneth K.; Blanchard, Andrew; Lee, Mark; Tuncer, Enis; Choi, Wooyeol

Issue Date
2020-08
Publisher
Institute of Electrical and Electronics Engineers
Citation
IEEE Antennas and Wireless Propagation Letters, Vol.19 No.8, pp.1466-1466
Abstract
Presents corrections to the above named paper.
ISSN
1536-1225
URI
https://hdl.handle.net/10371/199960
DOI
https://doi.org/10.1109/LAWP.2020.2999150
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area High Frequency Microelectronics, Microwave engineering, Radio Frequency Integrated Circuit, 초고주파 공학, 초고주파 시스템, 초고주파 집적회로

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