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A V-Band Parallel-Feedback Oscillator With a Micromachined Cavity Integrated on a Thin-Film Substrate

Cited 7 time in Web of Science Cited 8 time in Scopus
Authors

Song, Sangsub; Kim, Youngmin; Choi, Wooyeol; Kwon, Youngwoo; Seo, Kwang-Seok

Issue Date
2009-02
Publisher
Institute of Electrical and Electronics Engineers
Citation
IEEE Microwave and Wireless Components Letters, Vol.19 No.2, pp.107-109
Abstract
This letter p-resents a V-band cavity oscillator based on a thin-film substrate with a flip-chip interconnection. A cavity serves as a parallel-feed back element, which is fabricated using a micromachining technique and is flip-chip mounted on a thin-film substrate with integrated passives. A GaAs pseudomorphic high electron-mobility transistor is flip-chip mounted on the thin-film substrate as an active device to generate negative resistance. The fabricated cavity with I/O ports in the same side has a loaded Q of 352, a coupling of 5.3 dB, and a resonant frequency of 59.88 GHz. The developed parallel-feedback cavity oscillator has an output power of about 9.7 dBm and a low phase noise of -112 dBc/Hz: at 1 MHz offset with an oscillation frequency at 59.84 GHz. This work allows a low-cost mm-wave frequency source with high performances.
ISSN
1531-1309
URI
https://hdl.handle.net/10371/200015
DOI
https://doi.org/10.1109/LMWC.2008.2011334
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  • College of Engineering
  • Department of Electrical and Computer Engineering
Research Area High Frequency Microelectronics, Microwave engineering, Radio Frequency Integrated Circuit, 초고주파 공학, 초고주파 시스템, 초고주파 집적회로

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