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The flip-chip mounted MMIC technology using the modified MCM-D substrate for compact and low-cost W-band transceiver
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, S | - |
| dc.contributor.author | Kim, S | - |
| dc.contributor.author | Yeon, S | - |
| dc.contributor.author | Park, S | - |
| dc.contributor.author | Lee, JY | - |
| dc.contributor.author | Lee, S | - |
| dc.contributor.author | Choi, W | - |
| dc.contributor.author | Kwon, Y | - |
| dc.contributor.author | Seo, KS | - |
| dc.date.accessioned | 2024-04-30T01:24:45Z | - |
| dc.date.available | 2024-04-30T01:24:45Z | - |
| dc.date.created | 2024-04-26 | - |
| dc.date.created | 2024-04-26 | - |
| dc.date.issued | 2005 | - |
| dc.identifier.citation | 2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, Vol.2005, pp.1011-1014 | - |
| dc.identifier.issn | 0149-645X | - |
| dc.identifier.uri | https://hdl.handle.net/10371/200031 | - |
| dc.description.abstract | We present novel mufti-chip module (MCM)-D technology to improve the mechanical and thermal properties of a MCM-D substrate for a motherboard of the flip-chip structure. Advantages of the flip-chip mounted MMIC technology using the modified MCM-D substrate were investigated. Based on this investigation the W-band CPW MMIC amplifier using the 0.1-mu m GaAs pHEMT was successfully mounted on the modified MCNI-9 substrate by means of the flip-chip technology. Moreover, the W-band down-converter module with internal local oscillator (LO) source was realized with this technology. | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | The flip-chip mounted MMIC technology using the modified MCM-D substrate for compact and low-cost W-band transceiver | - |
| dc.type | Article | - |
| dc.identifier.doi | 10.1109/MWSYM.2005.1516838 | - |
| dc.citation.journaltitle | 2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4 | - |
| dc.identifier.wosid | 000234561201102 | - |
| dc.identifier.scopusid | 2-s2.0-33749246251 | - |
| dc.citation.endpage | 1014 | - |
| dc.citation.startpage | 1011 | - |
| dc.citation.volume | 2005 | - |
| dc.description.isOpenAccess | N | - |
| dc.contributor.affiliatedAuthor | Choi, W | - |
| dc.contributor.affiliatedAuthor | Kwon, Y | - |
| dc.contributor.affiliatedAuthor | Seo, KS | - |
| dc.type.docType | Proceedings Paper | - |
| dc.description.journalClass | 1 | - |
| dc.subject.keywordPlus | INTERCONNECTS | - |
| dc.subject.keywordPlus | LAYER | - |
| dc.subject.keywordAuthor | flip-chip | - |
| dc.subject.keywordAuthor | MMIC | - |
| dc.subject.keywordAuthor | MCM-D | - |
| dc.subject.keywordAuthor | RF | - |
| dc.subject.keywordAuthor | motherboard | - |
| dc.subject.keywordAuthor | BCB | - |
| dc.subject.keywordAuthor | Si-bump | - |
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Related Researcher
- Choi, Wooyeol최우열
- 조교수
- College of Engineering
- Department of Electrical and Computer Engineering
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