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Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics
Cited 42 time in
Web of Science
Cited 49 time in Scopus
- Authors
- Issue Date
- 2018-07
- Publisher
- National Academy of Sciences
- Citation
- Proceedings of the National Academy of Sciences of the United States of America, Vol.115 No.31, pp.E7236-E7244
- Abstract
- Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.
- ISSN
- 0027-8424
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