Browse

Study on the fabrication of flip chip lead-free solder bump by electroplating
전해도금에 의한 플립칩 무연 솔더 범프 제작에 관한 연구

Cited 0 time in Web of Science Cited 0 time in Scopus
Authors
황현
Advisor
강춘식
Issue Date
2002
Publisher
서울대학교 대학원
Description
Thesis (master`s)--서울대학교 대학원 :재료공학부,2002.
Language
English
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061997

http://hdl.handle.net/10371/30333
Files in This Item:
There are no files associated with this item.
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse