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초고집적 소자의 금속배선을 위한 화학증착 공정에서 계단도포성 개선을 위한 새로운 기술 : PACVD (Plasma assisted chemical vapor deposition)
A New technology for improvement of the step coverage in CVD process for ULSI metallization : PACVD (Plasma assisted chemical vapor deposition)

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Authors
김동찬
Advisor
주승기
Issue Date
1999
Publisher
서울대학교 대학원
Keywords
플라즈마plasma화학증착CVD알루미늄aluminumDMEAAmetallization배선
Description
학위논문(박사)--서울대학교 대학원 :금속공학과,1999.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000071449

http://hdl.handle.net/10371/34590
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Ph.D. / Sc.D._재료공학부)
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